COMPANY PROFILE / #985
Kandou AI
Saint-Sulpice, SwitzerlandVenture Capital-Backed
OVERVIEW
Operator of a semiconductor hardware company intended to support the development of scalable and energy-efficient artificial intelligence systems. The company applies silicon-proven wired copper multiple-input multiple-output interconnect technology that increases bit rate and link reach while reducing power use, and uses chiplet-based fabric methods for communication between chips within electronic systems, enabling clients to access compute capacity in a compact, affordable, and energy-saving format.
已融资504.60
最新估值380.00
员工数200
成立年份2011
公司概况
- Companies
- Kandou AI
- Description
- Operator of a semiconductor hardware company intended to support the development of scalable and energy-efficient artificial intelligence systems. The company applies silicon-proven wired copper multiple-input multiple-output interconnect technology that increases bit rate and link reach while reducing power use, and uses chiplet-based fabric methods for communication between chips within electronic systems, enabling clients to access compute capacity in a compact, affordable, and energy-saving format.
- Website
- —
- HQ Location
- Saint-Sulpice, Switzerland
- Year Founded
- 2011
- Keywords
- acceleration chips, application-specific semiconductors, chiplet technology, electronic chip, energy efficient chips, energy efficient product, semiconductor chips
- Competitors
- Wiliot, Astera Labs, Vesper (Electronic Equipment and Instruments), Kilopass, Avalanche Technology, Heptagon, Maxim Integrated Products, Advanced Micro Devices, S3 Semiconductors, Global Unichip, eSilicon, Nvidia, Achronix Data Acceleration, Montage Technology, eASIC, Silicon Mobility, Credo Technology Group, Presto Engineering, Silicon Laboratories, Sigenics, MACOM, Synapse Design, Brite Semiconductor
- Ownership Status
- Privately Held (backing)
- Company Financing Status
- Venture Capital-Backed
融资与估值
- Total Raised
- 504.60
- First Financing Date
- 02-Feb-2011
- First Financing Size
- 0.02
- First Financing Valuation
- —
- Last Financing Date
- 23-Mar-2026
- Last Financing Deal Type
- Later Stage VC
- Last Financing Size
- —
- Last Financing Valuation
- 380.00
- Last Financing Status
- —
- Last Known Valuation
- 380.00
- Last Known Valuation Date
- 23-Mar-2026
- Last Known Valuation Deal Type
- Later Stage VC
- Valuation Estimate
- —
- Valuation Estimate Growth Rate
- 14.97%
- Active Investors
- ACE Ventures (Geneva), AIchip Technologies, Bessemer Venture Partners, Cadence Design Systems, Climb Ventures, Columbia Lake Partners, DC Investment Partners, Ecole Polytechnique Federale de Lausanne, Eidgenössische Stiftung, Fathom Fund, Fayerweather Capital Partners, Flexstone Partners, Forestay Capital, Kreos Capital, Maverick Silicon, SoftBank Group, Swisscom Ventures, Synopsys, Venture Kick, Verve Ventures, Walden International
- # Active Investors
- —
- Acquirers
- —
团队与联系人
- Employees
- 200
- Employee Growth %
- —
- Employee History
- 2026: 200, 2025: 124, 2024: 187, 2023: 208, 2022: 188, 2021: 161, 2020: 84, 2019: 69 E, 2018: 53 E, 2017: 38 E, 2016: 22
- Primary Contact
- Srujan Linga
- Primary Contact Title
- Co-Founder, Chief Executive Officer & Board Member
- Primary Contact Email
- srujan@kandou.ai
- Primary Contact Phone
- +1 (347) 349-0231
增长与经营
- Revenue
- —
- Revenue Growth %
- —
- Growth Rate
- 2.59%
- Growth Rate % Change
- —
- Growth Rate Percentile
- 100
- Size Multiple
- 19.08x
- Size Multiple % Change
- 0.00%
- Size Multiple Change
- 0.00x
- Size Multiple Percentile
- —
- Majestic Referring Domains
- 342
- SimilarWeb Unique Visitors
- 1,121
- SimilarWeb Unique Visitors Change
- —
- SimilarWeb Growth Rate
- —
- SimilarWeb Growth Rate Percentile
- —
- Success Probability Over Time – 1 Year
- 13%
- Success Probability Over Time – 3 Year
- 27%
- Success Probability Over Time – 5 Year
- 34%
记录来源：public.companies · 原始序号 #985 · 所有字段均按数据库原值展示。